Annealing is a process used in semiconductor device manufacturing that involves heating multiple semiconductor wafers to modify their electrical properties. Heat treatments are designed to achieve various effects; wafers may be heated to activate dopants, densify deposited films, alter the state of grown films, repair damage caused by ion implantation, or facilitate the diffusion or transfer of dopants between films or into the wafer substrate.
Annealing can be integrated with other furnace processes, such as oxidation, or performed as a standalone operation. The process is carried out using equipment specifically designed for heating semiconductor wafers. These annealing furnaces are energy-efficient, batch-processing units featuring an ultra-energy-saving design that utilizes fiber-based insulation, resulting in 60% electricity savings.
